Graphene Nano Carbon Copper Foil Tape for EMI Shielding and Heat Dissipation

Nano Carbon Copper Foil Tape is a high-performance composite functional tape. It consists of a high-conductivity copper foil substrate, coated with a layer of nano-carbon material (graphene/carbon nanotubes) on one side and a high-temperature acrylic pressure-sensitive adhesive on the other.

This advanced material integrates the excellent electrical conductivity of copper with the superior thermal conductivity and radiation properties of nano-carbon, creating a highly efficient solution for thermal management and EMI shielding in modern electronics. It is thinner, more flexible, and more efficient than traditional graphite sheets or standard copper foil tapes.

Features:

• Ultra-High Thermal Conductivity: Thermal conductivity up to 600–800 W/m·K, far exceeding traditional copper foil (400 W/m·K) and graphite sheets. Efficiently spreads point heat sources into a uniform plane, lowering device temperature by 6–15°C.
• Superior EMI/RFI Shielding: Provides excellent electromagnetic interference shielding and grounding to protect sensitive circuits and ensure signal integrity.
• High Temperature Resistance: Stable performance with long-term service at 80°C and short-term tolerance up to 120°C.
• Strong Adhesion & Conformability: Flexible and easy to die-cut. Adheres securely to metals, plastics, and irregular surfaces with no residue.

Structures:

It is made of  nano-carbon material (graphene/carbon nanotubes) layer, copper foil layer and acrylic pressure-sensitive adhesive layer. Carbon nano tape thickness is 0.05mm and release film thickness is 0.075mm.

Applications:

Nano carbon copper foil tape is suitable for shielding and heat dissipation of LCD (without steel sheet)/OLED assemblies. It is also used for shielding electronic equipment or instruments against electromagnetic interference.

Consumer Electronics

• Heat dissipation for smartphones, tablets, laptops, and gaming devices.
• Cooling for CPU/GPU chips, batteries, and camera modules.
• EMI shielding for internal components and FPC cables

Communications & Data Centers

• Thermal management for 5G base stations, RF power amplifiers, and routers.
• Heat spreading for servers, SSDs, and high-speed communication equipment.
• Shielding for telecom enclosures and PCB assemblies.

Automotive & New Energy

• Thermal interface for EV battery packs, BMS, and charging modules.
• Heat dissipation for motor controllers, inverters, and automotive electronics.
• EMI protection for in-vehicle sensors and infotainment systems.

Industrial & LED Applications

• Heat sink bonding for high-power LEDs and lighting fixtures.
• Insulation and shielding for transformers, capacitors, and power modules.
• Repair and grounding for flexible circuits and PCB repairs.

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